Building the Cerebras CS-3 AI Supercomputer with Flex
Cerebras CS-3 AI supercomputer uses wafer-scale engine requiring 26 kW of vertical power delivery
“A total of about 26 kW total into the chip.”
A Cerebras manufacturing tour video shows the CS-3 AI supercomputer being assembled at Flex's Milpitas campus, highlighting the wafer-scale engine package with 84 dies and novel top-down power delivery MCMs feeding 26 kW into the chip. This is a marketing/manufacturing showcase rather than a new announcement. The engineering detail on vertical power delivery to a wafer-scale chip is mildly interesting but represents existing Cerebras CS-3 product, not new signal.